Thailand unveils semiconductor roadmap to build domestic high-tech capacity

Thailand has launched a national semiconductor development strategy aimed at creating a stronger domestic chip ecosystem and expanding the country’s position in the regional high-tech industry landscape, as reported by VNA, a TV BRICS partner.

The new Siam Silica Framework was presented by the Ministry of Higher Education, Science, Research and Innovation at a meeting of the National Higher Education, Science, Research and Innovation Policy Council. The initiative sets out a long-term roadmap to develop semiconductor capabilities, attract innovation and improve technological competitiveness.

Under the strategy, Thailand plans to establish key elements of a semiconductor value chain by 2030, including eight integrated circuit design companies, one semiconductor fabrication facility and two advanced semiconductor packaging centres.

The roadmap focuses on five priority areas: photonics manufacturing, advanced semiconductor packaging, silicon design, quantum photonics and power electronics. These fields are expected to support future industries and strengthen Thailand’s ability to participate in the global technology market.

A major part of the initiative is workforce development. Thailand aims to train more than 3,000 specialists across different levels, including university lecturers and scientists, research professionals, advanced engineers and technical specialists.

The government also plans to expand regional cooperation within ASEAN to support semiconductor growth. Proposed measures include creating an ASEAN Talent Observatory to monitor future workforce needs, expanding skills development initiatives, increasing joint research and development programmes, and integrating photonics and printed circuit board technologies into the regional semiconductor strategy.