India’s semiconductor programme supports 200 chip design companies and trains 70,000 engineers
India expands domestic semiconductor capabilities as new chip design companies emerge and international cooperation grows across manufacturing, research and advanced packaging
At least 200 chip design companies have emerged under the India Semiconductor Mission 2.0 (ISM 2.0), strengthening the country's efforts to develop domestic semiconductor intellectual property, according to Union Minister for Electronics and Information Technology Ashwini Vaishnaw.
More than 105 chip design start-ups have gained access to advanced Electronic Design Automation tools, supporting the development of India's semiconductor design ecosystem, as reported by IANS, a TV BRICS partner.
India has also trained around 70,000 chip design engineers over the past four years, moving towards its target of 85,000 specialists, Vaishnaw said.
The minister highlighted progress in semiconductor manufacturing under the first phase of the India Semiconductor Mission. Five of the 12 plants approved under ISM 1.0 have started commercial production.
Vaishnaw said India's semiconductor strategy is focused on combining quality with competitive costs while strengthening domestic intellectual property capabilities.
The initiatives form part of India's broader effort to expand its semiconductor design and manufacturing capacity while developing a skilled engineering workforce and strengthening international technology partnerships.
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